Precision Metal Components for Semiconductor, Hardware, & Fab Applications
Semiconductor fabrication and chip packaging require stamped metal components held to dimensional tolerances that leave no margin for variation, produced consistently at volumes that demand a stable, validated manufacturing process. Components used in wafer processing, chip packaging, and CPU assembly feed directly into automated equipment and assembly lines where a non-conforming part causes downstream failures rather than being caught at a manual inspection step.
Brunk has supplied precision-stamped components to semiconductor OEMs since 1995, drawing on the tooling depth, materials expertise, and process discipline developed through decades of medical device manufacturing where equivalent tolerance requirements have applied since 1960.
Precision Contacts & Spring Elements for Semiconductor Test Equipment
Brunk produces precision-stamped contacts, spring elements, and probe components for semiconductor test and burn-in equipment. The performance requirement is not just dimensional — it is electrical and mechanical consistency sustained across an operational life measured in millions of insertions.
We run these programs with the same process discipline we bring to implantable medical device components. The tolerance window does not shift because the volume is high or the cycle count is long. That consistency is the product.
Stiffener Plates & Rings
Flatness is a functional requirement in this application because substrate planarity through the packaging process directly affects downstream assembly yield and long-term field reliability. Brunk produces precision-stamped stiffener plates and rings to the flatness and dimensional tolerances chip packaging requires, with in-house tooling that supports consistent output across production runs in the alloys this application commonly specifies.
Fab Carriers & Assembly Hardware
Carriers used in chip assembly, including laser-welded carriers, spring carriers, and mag carriers, are components that interface directly with automated assembly equipment. Brunk has supplied laser-welded carriers and assembly hardware to semiconductor OEMs for decades, using in-house precision stamping and laser welding to produce these assemblies without distributing critical process steps across outside vendors.
Materials
Stainless steel, titanium, MP35N, copper alloys, red metals, and other conductive and structural alloys suited to sterilizable, high-cycle surgical and endoscopic applications.
